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architecture, and the EEPROM and the RAM is seen as DATA memory for storing constants and variables. 0 to 10-MHz clock speed operation. Most instructions operate in 1 clock cycle, and this leads to an almost 10-times performance improvement over conventional processors (e.g., the 8051) operating at equal clock frequency. Power On RESET circuit. On-chip programmable timer with separate prescalar. This is used for timing applications. Internal and external interrupt sources. Programmable watchdog timer with independent oscillator. This is used to recover in case of software crash but can also be used for other interesting applications as discussed in one of the project chapters. SLEEP and POWER DOWN modes of operation. This saves power when the processor is idling. Many chips with on-chip RC clock oscillator. Using the on-chip RC oscillator feature when available leads to an even lower component count. Wide device range (from a small 8-pin processor to a 68 pin processor), and one can choose a processor to suit a given requirement while being able to use the same development facilities. (Figure 3.1)

FIGURE 22.7 Compatibility of via hole formation methods with four basic dielectric layer structures.

The specification IPC-4104 will define material requirements for HDI applications. This IPC specification applies only to the surface HDI layers, the conventional multilayer core materials are covered by IPC specification IPC-4101B.

05 m

Dielectric Format Coated Foil Reinforced Unreinforced Conventional Reinforced Laminate Woven Non-woven Liquid Photoimageable Non-photoimageable Dry Film Photoimageable Non-photoimageable

Material and technology choices for SBU fabrication. (Courtesy of DuPont.)

Materials for HDI Microvia Fabrication Figure 22.8 shows a material and technology selection flowchart for use when choosing dielectric materials. In using the flowchart, you should ask the following questions regarding the dielectric you are considering:

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Will the dielectric use chemistry compatible with current chemistry used by core substrate material Will the dielectric have acceptable plated copper adhesion (Many original equipment manufacturers [OEMs] want 6 lb/in [1.08 kgm/cm] per 1 oz. [35.6 mm] copper.) Will the dielectric provide adequate and reliable dielectric spacing between metal layers Will it meet thermal needs Will the dielectric provide a desirable high Tg for wire bonding and rework Will it survive thermal shock with multiple SBU layers (i.e., solder floats, accelerated thermal cycles, multiple reflows) Will it have platable, reliable microvias (that is, will it have latitude to ensure good plating to the bottom of the via)

The AVR uses Harvard architecture. This entails separate data and program memory buses. Figure 3.2 illustrates the controller layout. The data memory data bus is an 8-bit bus and connects most of the peripheral components to the register file. The program memory data

005 m

22.5.1.1 Copper-Clad Dielectric Materials. Due to relative ease of implementation, copperclad dielectrics are used on a larger scale than unclad dielectrics. Copper-clad dielectrics provide a method that requires the least number of changes in manufacturing flow because they typically use the same dielectric and reinforcements found in standard PWBs. Copper-clad-based materials have a longer history in making blind vias than any other method. This makes many designers, OEMs, and PWB fabricators more comfortable with copper-clad-based materials. These materials can be nonreinforced or reinforced. The reinforcement can be woven or non-woven and can be aramid, glass, and so on.These dielectrics are suitable for via formation by laser or other mechanical removal methods.

Due to its wide availability and familiarity, FR-4 material is often initially evaluated in laser-drilling microvias Reinforced with thin 106 or 1080 woven glass (since thicker glass is more difficult to vaporize with lasers, but there is 1086 uniform-woven glass just for laser ablation), one- or two-ply laminates are selected with a resin content close to 70 percent The laser drilling is done by ablation of the via using a conformal mask or a directly focused beam, with either an ultraviolet (UV) Nd:YAG or a CO2 laser These materials may also be coated on a copper foil Typical applications use single-side clad material where the copper clad is used as the outer layer and the C stage is bonded to the subcomposite These materials are suitable for via formation using methods such as plasma or laser To meet fine circuitry and smaller via needs, very thin copper is available.

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