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Another approach, practiced by many Asian PWB fabricators, is to thin down incoming copper clad by etching and/or planarizing the copper surface precisely 22512 Unclad Dielectric Materials If the dielectric is reinforced, microvias are formed by laser drilling or other mechanical means If it is nonreinforced, it can be photoimageable in addition to the previous choices To add conductivity, subtractive processing is the standard manufacturing practice in the United States and Europe Semi- or fully additive techniques have been practiced in continuous high volume only in Asia, most notably Japan In Japan, which leads the world in microvia production, about 22 percent of manufacturing begins with a non-copper-clad dielectric material Japan has long accepted the additive manufacturing methodology for creating circuits on the board surface as well as the through-hole connection.

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The trade-off between clad and unclad dielectric materials follows a benefit analysis similar to that used for subtractive versus additive processing Copper-clad-based material is fabricated using standard practices familiar to most shops However, it innately generates more waste and has a higher cost due to the subtractive nature of the manufacturing sequence In addition, copper-clad materials demonstrate limitations in fine-line capability similar to those seen with standard manufacturing methods used today Unclad dielectrics require considerable resources for optimized plating of copper to achieve reliable and consistent copper peel strengths Unclad dielectrics and thin copper-clad dielectrics, however, gain in importance as the requirements for line and space geometries reach 75 m and required via sizes are lower than 75 m in diameter Figure 229 depicts the influence of base copper on the aspect ratio of a via.

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The base copper increases the aspect ratio, making it more difficult to plate the via, and can cause issues with bottlenecking whereby the via plates shut at the top without sufficient plating in the bottom Other data show that thinner copper etches more uniformly, which helps the cause for controlled impedance..

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FIGURE 22.9 Impact of 1.2 oz. base copper on the aspect ratio of a 50 m via. (Courtesy of Vantico.)

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bus is 16 bits wide and only feeds the instruction register. Even though Figure 3.2 refers to the AVR AT90S2313 controller, it applies equally well to all the processors and differs only to the extent of having additional (or less) peripheral components as well as differing in amounts of program memory and data memory. The program memory is a continuous chunk of flash memory. The exact amount varies from processor to processor. The AT90S1200, the base level processor, has 1 Kbyte of program memory organized as 512-X-16 bits, while the Mega103 has 128 Kbytes of memory organized as 64K-X-16 bits. A K here equals 1024 and not 1000. The program memory is accessed every clock cycle, and an instruction is loaded into the instruction register. The instruction register feeds the register file, selecting which of the registers will be used by the ALU for instruction execution. The instruction register output is also decoded by the instruction decoder to decide which control signals will be activated for completing the current instruction. The program memory, besides storing instructions, also stores interrupt vectors starting at address $0000. The actual program should start at memory location beyond the space meant for the vectors. The number of vectors vary from processor to processor.

TABLE 22.3 Utilization of Unclad Dielectrics by Key Market Segments4 Chip package substrates HDI penetration Line/space and via diameter (year 2000) Use of unreinforced dielectrics Use of unclad dielectrics

22.5.1.3 Clad versus Unclad Dielectric Materials. Table 22.3 compares the utilization of clad versus unclad dielectric materials as circuit geometry shrinks. This table shows that as the technology requirements get tougher, the trend toward using unclad dielectrics increases. As line and space requirements get denser, and via diameters get smaller, requirements for chip package substrates to use unclad or thin copper dielectrics increase. In the case of mobile phones and other portable applications, for example, it is foreseen that by the year 2005 lines and spaces will be down to 50 to 75 m, respectively, and via sizes to 50 m, with a subsequent high usage of unclad material. 22.5.2 Examples of HDI Microvia Organic Substrates From a mechanical standpoint, materials may be grouped as reinforced and nonreinforced laminates and prepregs, as in Fig. 22.8. Reinforced materials are generally better in dimensional stability, lower in coefficient of thermal expansion (CTE), and less sensitive to thermal cracking, whereas nonreinforced materials often have a lower dielectric constant (Dk) and may be photoimageable. This can be seen in Fig. 22.10, which shows the Dj versus Dk (at 1 MHz) of various resins and reinforcements.

FIGURE 22.10 Dielectric options of resins and reinforcements by dissipation factor (Dj) versus dielectric constant (Dk). (Source: Holden Consulting.)

0005 m

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